Fan-Out Package Workshop 2018
9:00 am ~ 4:10 pm, Oct. 18th (Thursday)
Room 205, Electronics & Information Engineering Building (2F), Global Campus, Kyung Hee University, Suwon, Korea.
[ INVITATION ]
The application of Fan-out Package is expanding rapidly, ranging from small devices to high-end mobile processors and SiP modules.
High yielding integration of Fan-out Package is requiring innovative breakthroughs in all areas including IC chip design, RDL fabrication, measurement and inspection, and verification tools. Equipment and materials are key elements to be innovated.
Close collaboration among industry, universities, and research institutes is crucial to resolve those challenges.
The organizers of the workshop have invited leading experts from diverse sites to share their expertise and experiences with others who need guidance and advice.
You are cordially invited to the forum of informative lecture and open discussion with leaders in this field.
Joong-Hwee Cho (Vice President, Semiconductor Society, IEIE)
Jinsang Kim (Workshop Organizer)
Tae-Je Cho (Workshop Organizer)
URL : http://fanout-package2018.ieieweb.org/user/index.asp