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외부공지 | Fan-out Package Workshop 2017 개최 안내

Fan-out Package Workshop 2017
Sept. 28th , 2017 (Thursday)  / Kyung Hee University, Suwon, KOREA
Invitation
 
Invitation
 
This year, the workshop focuses on Fan-out Package. Fan-out Packages are getting significant momentum as fine pitch, small form-factor, and heterogeneous integration solutions.
The application of Fan-out Package is expanding rapidly, ranging from small devices to high-end mobile processors and SiP modules.
 
High yielding integration of Fan-out Package is requiring innovative breakthroughs in all areas including IC chip design, RDL fabrication, measurement and inspection, and verification tools. Equipment and materials are key elements to be innovated.
Close collaboration among industry, universities, and research institutes is crucial to resolve those challenges.
 
The organizers of the workshop have invited leading experts from diverse sites to share their expertise and experiences with others who need guidance and advice.
You are cordially invited to the forum of informative lecture and open discussion with leaders in this field.

 
Young-Hyun Jun (President, Semiconductor Society, IEIE)
Joonghwee Cho (Vice President, Semiconductor Society, IEIE)

Jinsang Kim (Workshop Organizer)
Tae-Je Cho (Workshop Organizer)
 
Workshop
 

O Title : Fan-out Package Workshop 2017
O  When :  9:00 am. ~ 17:10 pm., Sept. 28th , 2017 (Thursday)
O  Where : 
Room 205, Electronics & Information Engineering Building (2F),
                Global Campus, Kyung Hee University, Suwon, KOREA
                * Language : Korean or English
O  Sponsors : Semiconductor Society of  IEIE,
                   IEEE CASS, and Kyung Hee University IT-SoC Research Center

 
Program  
 
Time Topic Chair/Speaker
08:30-09:00 Registeration  
08:55-09:00 Opening Young-Hyun Jun, President
(The Semiconductor Society, IEIE)
Session-1 : Trends and Market
09:00-09:40 Fanout Package; Opportunities and Challenges Choon Heung Lee
(President, LAM Research)
09:40-10:10 Market and Technology Trends in Fan-out Packaging Santosh Kumar
(Dir. of 3DIC,Yole)
10:10-10:30 Coffee Break
10:30-11:00 Design Methodology for Fanout Packaging Jae-Ho Lee
(Dir, Cadence)
11:00-11:30 Research and Development for Fanout Packaging Eric Beyne
(Fellow, IMEC)
11:30-12:00 High-density multi RDL layers Enabled by Excimer Laser Dual Damascene Process for Wafer and Panel Level Packaging Matthew Gingerella
(Application Professonal,
SUSS MicroTec)
12:00-13:10 Lunch & Social
Session-2 : Technology Development
13:10-13:40 WLP, FO-WLP PID Development Takuji Ikeda
(Sr Researcher,
Sumitomo Bakelite)
13:40-14:10 Encapsulation Materials for Fanout Ikeuchi Takatoshi
(Sr Researcher,
Hitachi Chemical)
14:10-14:40 Measurement Technology for fan-out packages Motozuna Masamichi
(Nikon)
14:40-15:10 PVD and Dry Etch Process Solutions for Fan Out Packages David Butler
(EVP, Prouduct Management
and Marketing, SPTS)
15:10-15:30 Coffee Break
15:30-16:00 Temparory Bonding, Debonding Technology Otaka Shoji
(GM, TOK)
16:00-16:30 Recent Advances and Trends in fan-out Packaging Technology Won-Chul Do
(Dir, Amkor)
16:30-17:00 Advanced eWLP FOWLP: Enabling Integrated Packaging Solutions Seung-Wook Yoon
(Dir. Technical Marketing, Statschippac)
17:00-17:10 Closing Prof. Joonghwee Cho,
V.President
(The Semiconductor Society, IEIE)
 
Registration
 
등록비 구분
 구분
일반
학생
사전등록
160,000원
90,000원
현장등록
180,000원
100,000원
 
   o 사전등록:   2017년 9월 25일(월) 까지  
      o  입금계좌: 186-00027-241  한국씨티은행
      o 예금주: 대한전자공학회
     위 계좌로 입금 후 사전등록신청서를 웹(http://fanout-package2017.ieieweb.org)으로 작성하여 주시기 바랍니다.
     기타 문의사항이 있는 경우에는 본 메일로 E-mail(biz@theieie.org)로 문의하여 주시기 바랍니다.
  
    o 영수증 및 계산서 발급안내
결제방법
카드영수증
계산서(전자,종이)
거래명세서
카드결제
가능(온라인 출력가능)
불가능(이중발급)
기본발행
계좌이체 및 무통장 결제
불가능
가능
(전자-이메일발행, 종이-현장발부)
기본발행
      ※ 계산서는 온라인에서 신청해 주시기 바랍니다. 카드결제시 계산서 발급은 불가능합니다.
      ※ 웹 카드결제시, 전표출력 웹사이트 :  www.allatpay.com .
 
    o 문의처
      o 담당: 대한전자공학회  배기동 차장
      o Tel. 02-553-0255(내선5), Fax:02-552-6093
      o  http://www.theieie.org, E-mail: biz@theieie.org

       [Registration]
      Wiring Account: 186-00027-241 (City Bank, Beneficiary of IEIE)
      Contact Gi-dong Bae at IEIE regarding registration.
      (+82) 2-553-0255 (ex. 5) http://www.theieie.org, biz@theieie.org
 
Venue
 
Electronics & Information Building (2F),
Global Campus, Kyung Hee University, Suwon, KOREA

경희대학교 국제캠퍼스(수원) 전자정보대학, 2층 (205호)

 
 
[Transportation]
 
1.By Car
  From Gyeongbu Express Way

  -> Suwon Exit -> Two consecutive left turns after toll -> Precede 4km Turn left at Kyung Hee University

  From Yongin-Suseo Express Way
  -> Cheongmyeong Exit  -> Right turn at Hagal intersection -> 1.5km to turn left to Kyung Hee University
 
2. By Subway
Off at Suwon station of red line (line number 1), and take any bus of 5, 7, 7-2, 310, 900.
Bus brings you to Kyung Hee University in 30 minutes.
 
3. Inter-city Buses from Subway Stations in Seoul
Yangjae Station(#3): 5100, 1550-1, Gangbyeon Station(#2): 1112,
Jamsil Station(#2): 1112, 1007-1, Sadang Station(#2 & #4): 7000
 
4. Suwon City Bus
   #5, #7, #7-2, #9, #34, #116-3, #310, #900